rtt

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--- rtt [2025/08/31 10:05] – 만듦 changhun
+++ rtt [2025/08/31 10:25] (현재) – changhun
@@ 줄 9: / 줄 9: @@
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 ===Soldering Technical Terms===
-==CLSS (Component Lead Side Soldering)==
+==1. CLSS (Component Lead Side Soldering)==
 \\
-CLSS is a commonly used soldering technique.
 It typically involves placing a component on the PCB pads, securing it with tweezers, and soldering the lead pads using a soldering iron
+This technique is primarily used for electronic components that have leads
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 \\
+==2. CPSS (Component Pins Side Soldering)==
+\\
+It typically involves placing a component on the PCB pads, securing it with tweezers, and soldering the pin pads using a soldering iron
+This technique is primarily used for SMD-type electronic components that have pins (pads)
+\\
+\\
+==3. CLHS (Component Lead Heating Soldering)==
+\\
+This method involves placing an electronic component on PCB pads that have pre-applied solder and soldering it using a hot air gun.
+This technique is mainly used for small PCBs with high component density or in locations where soldering with a soldering iron is difficult, and is typically applied when soldering SMD components such as MLCCs.
+If space permits, using CPSS is recommended whenever possible
+\\
+\\
+==3. QFN-SOB (QFN Soldering on board)==
+\\
+This is a method for soldering QFN-type ICs by pre-applying solder on the PCB pads and then using a hot air gun to solder the IC.
+This term can be used to refer to the following approaches:
+Evenly applying solder to eliminate height differences, placing the QFN IC, and soldering it using a hot air gun.
+Applying solder, placing the QFN IC, and using a hot air gun while pressing the IC with tweezers or other tools to ensure maximum contact with the PCB, then cleaning up any excess solder
+\\
+\\
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 ===Reconstruction Technical Terms===
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rtt.txt · 마지막으로 수정됨: 2025/08/31 10:25 저자 changhun