rtt_stands_for_repair_technical_terms
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| rtt_stands_for_repair_technical_terms [2025/09/05 13:48] – 만듦 changhun | rtt_stands_for_repair_technical_terms [2025/09/30 09:20] (현재) – 제거됨 changhun | ||
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| - | ==== RTT stands for Repair Technical Terms ==== | ||
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| - | Here, a Repair Technical Term refers to the designation of a specific action performed during a technical repair. | ||
| - | These terms are named in a highly intuitive manner, and they are intended to serve as a nationwide standard that we should adopt and use | ||
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| - | ===Soldering Technical Terms=== | ||
| - | ==1. CLSS (Component Lead Side Soldering)== | ||
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| - | It typically involves placing a component on the PCB pads, securing it with tweezers, and soldering the lead pads using a soldering iron | ||
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| - | This technique is primarily used for electronic components that have leads | ||
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| - | ==2. CPSS (Component Pins Side Soldering)== | ||
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| - | It typically involves placing a component on the PCB pads, securing it with tweezers, and soldering the pin pads using a soldering iron | ||
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| - | This technique is primarily used for SMD-type electronic components that have pins (pads) | ||
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| - | ==3. CLHS (Component Lead Heating Soldering)== | ||
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| - | This method involves placing an electronic component on PCB pads that have pre-applied solder and soldering it using a hot air gun. | ||
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| - | This technique is mainly used for small PCBs with high component density or in locations where soldering with a soldering iron is difficult, and is typically applied when soldering SMD components such as MLCCs. | ||
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| - | If space permits, using CPSS is recommended whenever possible | ||
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| - | ==3. QFN-SOB (QFN Soldering on board)== | ||
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| - | This is a method for soldering QFN-type ICs by pre-applying solder on the PCB pads and then using a hot air gun to solder the IC. | ||
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| - | This term can be used to refer to the following approaches: | ||
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| - | Evenly applying solder to eliminate height differences, | ||
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| - | Applying solder, placing the QFN IC, and using a hot air gun while pressing the IC with tweezers or other tools to ensure maximum contact with the PCB, then cleaning up any excess solder | ||
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| - | ===Reconstruction Technical Terms=== | ||
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rtt_stands_for_repair_technical_terms.1757080104.txt.gz · 마지막으로 수정됨: 저자 changhun