===Soldering Technical Terms===
**1. CLSS (Component Lead Side Soldering)**

It typically involves placing a component on the PCB pads, securing it with tweezers, and soldering the lead pads using a soldering iron

This technique is primarily used for electronic components that have leads


**2. CPSS (Component Pins Side Soldering)**

It typically involves placing a component on the PCB pads, securing it with tweezers, and soldering the pin pads using a soldering iron

This technique is primarily used for SMD-type electronic components that have pins (pads)


**3. CLHS (Component Lead Heating Soldering)**

This method involves placing an electronic component on PCB pads that have pre-applied solder and soldering it using a hot air gun.

This technique is mainly used for small PCBs with high component density or in locations where soldering with a soldering iron is difficult, and is typically applied when soldering SMD components such as MLCCs.

If space permits, using CPSS is recommended whenever possible


**4. QFN-SOB (QFN Soldering on board)**

This is a method for soldering QFN-type ICs by pre-applying solder on the PCB pads and then using a hot air gun to solder the IC.

This term can be used to refer to the following approaches:

Evenly applying solder to eliminate height differences, placing the QFN IC, and soldering it using a hot air gun.

Applying solder, placing the QFN IC, and using a hot air gun while pressing the IC with tweezers or other tools to ensure maximum contact with the PCB, then cleaning up any excess solder