Here, a Repair Technical Term refers to the designation of a specific action performed during a technical repair.

These terms are named in a highly intuitive manner, and they are intended to serve as a nationwide standard that we should adopt and use

It typically involves placing a component on the PCB pads, securing it with tweezers, and soldering the lead pads using a soldering iron

This technique is primarily used for electronic components that have leads

It typically involves placing a component on the PCB pads, securing it with tweezers, and soldering the pin pads using a soldering iron

This technique is primarily used for SMD-type electronic components that have pins (pads)

This method involves placing an electronic component on PCB pads that have pre-applied solder and soldering it using a hot air gun.

This technique is mainly used for small PCBs with high component density or in locations where soldering with a soldering iron is difficult, and is typically applied when soldering SMD components such as MLCCs.

If space permits, using CPSS is recommended whenever possible

This is a method for soldering QFN-type ICs by pre-applying solder on the PCB pads and then using a hot air gun to solder the IC.

This term can be used to refer to the following approaches:

Evenly applying solder to eliminate height differences, placing the QFN IC, and soldering it using a hot air gun.

Applying solder, placing the QFN IC, and using a hot air gun while pressing the IC with tweezers or other tools to ensure maximum contact with the PCB, then cleaning up any excess solder